18 Sep

Modern Manageability Manufacturing Customer Engineer Jobs Vacancy in Intel 台北市

Position
Modern Manageability Manufacturing Customer Engineer
Company
Intel
Location
台北市 TPE
Opening
18 Sep, 2018 30+ days ago

Intel 台北市 urgently required following position for Modern Manageability Manufacturing Customer Engineer. Please read this job advertisement carefully before apply. There are some qualifications, experience and skills requirement that the employers require. Does your career history fit these requirements? Ensure you understand the role you are applying for and that it is suited to your skills and qualifications.

Follow the online directions, complete all the necessary fields, and provide all relevant information so your application is submitted correctly. When you click the 'Apply this Job' button (open in new window) you will be taken to the online application form. Here you will be asked to provide personal and contact details, respond to employment-related questions, and show how you meet the key selection criteria.

Modern Manageability Manufacturing Customer Engineer Jobs Vacancy in Intel 台北市 Jobs Details:

Job Description

Experienced software engineer with good manufacturing line experience to join us on customer manufacturing enablement on customer IA product, focus mainly on corporate sku devices. Responsibilities include enable customer to ensure manufacturing readiness to integrate future Intel corporate manageability features:-Train external customers and internal team on manufacturing requirement and process -Help to enable and customize customers' line to meet all Intel/OEM/ODM and OS vendor requirement -Support customer manufacturing issues triage, debug and replicate issues-Help customers to meet Intel/ODM/OEM and OS vendor MP criteria for TTM -Drive Intel internal team and OS vendor to define manufacturing requirement meeting ODM/ODM manufacturing needsAdditionally, you will need to manage technical relationships between OEMs/ODMs/OS vendor and Intel and to drive customer products to success and TTM.


Qualifications

You must possess a Bachelor of Science degree in Electrical Engineering or Computer Science with more than 5 years of industry experience in software debug or low-level software engineering. An advanced degree is preferred. Additional qualifications include: -Working knowledge of Intel architecture hardware, software, firmware, knowledge with Intel ME, AMT and vPro is a big plus-Excellent communication including spoken and written English and customer support skills-Must have solid experience in script languages like BASH/Python.-Knowledge of motherboard and/or system manufacturing test process and understand limitation/pain point for manufacturing -Excellent problem solving skills, comfortable with the use of software tools to diagnose and debug BIOS, firmware and software issues -Working knowledge of BIOS operations and interdependencies -Working knowledge of fundamental networking technologies, such as network layers, Ethernet, MAC, TCP/IP, HTTP, TFTP, DHCP, 802.11, and associated areas-An in-depth understanding of business relationships with Original Equipment Manufacturers OEM or Original Design Manufacturers ODM customers would be an added advantage -Knowledge of C, C++, XML and/or other programmingKey behaviors/soft skills required for this position: - Self-discipline and self-direction - Multitasking - Presentation skills - Creativity - Customer orientation - Project planning - Situational Leadership - Tolerance of ambiguity - Working independently as well as in a team setting - Working across language/cultural barriers and time zones with success - Travel to customer facilities is required


Inside this Business Group

The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.


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